Vision 320 RIE
The Vision 320 RIE provides etch capability for R&D, prototyping, and low volume production. This parallel-plate capacitance based systems is found in applications that include fundamental material studies, surface modification, semiconductor device fabrication, and failure analysis involving delayering.
Hardware:
•Up to 10 gas channels
•Close couple turbo pump for high conductance
•305mm substrate platen
•CE/UL compliant
•DeviceNet (digital) field bus for faster, more accurate, and trouble free operation
•Open load for easy access
•Best-of-breed OEM components (standard “off the shell”) for fast parts availability
•Digital MFCs (metal sealed, isolated)
•Compact footprint (<0.6 m2)
Software:
•User friendly Digital communication using DeviceNet
•Data logging and recipe management through open SQL Server environment
•Integrated endpoint control
•Alarm history, multiple user access levels, on-the-fly recipe control
•Real-time process data display
•Easy and safe override maintenance screens
- Description
- Additional information
Description
HIGHLIGHTS
Easy access construction for outstanding ease of service and maintenance.
Proven open-load system installed worldwide at leading universities and industrial facilities.
Vision 320 RIE – Innovative Design and Construction.
A Low Cost Solution for Applications that include:
+ R&D – Fundamental semiconductor and material science research for etching, surface modification.
+ Failure Analysis – critical quality assurance applications (delayering and reverse engineering).
+ Prototyping and Low Volume Production – an economical solution.
Vision 320 RIE (Reactive Ion Etch) configuration is fully characterized for a wide range of etching processes that includes:
+ Dielectrics: oxides, nitrides, metal oxides.
+ Materials: silicon, germanium, IIIV – GaAs, GaN, InP, InGaAs.
+ Polymers: resists, polyimides, BCB, SU-8.
| – Electrode Size | 12” (305mm) diameter |
| – Electrode Temperature Ambient (liquid cooled) | Ambient (liquid cooled) |
| – Electrode Material | Aluminum with Graphite Cover (other optional materials available) |
| – RF Electrode Bias | Capacitive, 600W power supply, 13.56 MHz |
| – Vacuum Pumping | 250 l/s Edwards (ceramic bearing) turbo |
| – Base Pressure | <1x10e-6 Torr |
| – Pressure Control | Automatic, 0 – 1 Torr |
| – Gas Lines | Std 4 channels, (Digital MFCs) |
| – Control System | PLC, DeviceNet |
| – Software | PLC (XP/Windows 7), with data logging |
| – Power Requirements | 25A @ 200/208 V, 60 Hz, 3-phase 16A @ 380/400 V, 50 Hz, 3-phase |
| Dimensions: | – Height 117.2 cm (214.7cm with gasbox mounted on system) – Depth 93.4 cm – Width 73.0 cm |
| Typical weights of system components: | – On-board system (gas panel on-board): 305 kg – Remote system (remote gas panel): 265 kg – 4-line gas pod: 40 kg – 12-line gas pod: 65 kg – Backing Pumps: + Drytek-brand, model PS80-A dry vacuum pump: 120 kg. – Chiller: 40 kg |
| – Process Library: Vision systems come with a well-developed process library. – Endpoint: Both laser and optical emission spectroscopy endpoint technologies are available to augment processing capability. – Data Logging: Simplified data collection for sharing of process monitoring and recipe information. – Factory Communication: When enabled and combined with advanced self-diagnostic features, the system communicates status to the factory, assisting preventive maintenance scheduling and detecting abnormal issues. – Digital communication using DeviceNet. – Data logging and recipe management through open SQL Server environment. – Integrated endpoint control with optional Optical Emission Spectroscopy (OES). – Alarm history, multiple user access levels, on-the-fly recipe control. – Real-time process data display  |
| – Power Supply: | 25A @ 200/208 V, 60 Hz, or 3-phase 16A @ 380/400 V, 50 Hz, 3-phase |
| -Systems environmental conditions (clean room): % | – Maximum: 25°C – Minimum: 15°C |
| – Relative humidity at 20°C | – Maximum: 75% – Minimum: 25% |
| – System compressed air (CDA) with on- board gas box: | + Flow: 2 SLPM + Min: 6 bar (g) + Pressure Max: 10 bar (g) 5 microns Oil content <0.01mg/m3 |
| – System N2 for gas box purge: | + Flow: <1 SLPM + Inlet pressure: >1 bar (g) + Max pressure: <4 bar (g) + Purity: ≥99.9995% |
| – System N2 for chamber ventilation: | + Flow: <20 SLPM + Inlet pressure: >1 bar (g) + Max pressure: <4 bar (g) + Purity: ≥99.9995% |
| – N2 for turbo purge: | + Flow: <100 sccm + Inlet pressure: >1 bar (g) + Max pressure: <2 bar (g) + Purity: ≥99.9995% |
| – Process gas in: | + Flow: Process dependant + Inlet pressure: >1 bar (g) + Max pressure: <4 bar (g) |
| – Water cooling: | Process turbo: + Flow: >2.5 l/m <5 l/m + Inlet pressure: 1-3 bar (g) +Purity: 100 microns Lower electrode cooling + Flow: >3 l/m <5 l/m + Inlet pressure: >2 bar (g) + Purity: 100 microns + Resistance: >18 MΩ + Temperature: As required by process |
– Extensive etch process library that includes
+ Dielectrics (e.g. SiNx, SiO2, a-Si, SiOxNy, Ta2O5)
+ Metals (fluorine based or sputtered etched)
+ Polymers (e.g. polyimide, BCB, photoresist)
+ Compound Semiconductors (fluorine based, e.g. SiC,, H2/CH4 e.g. InP)
– Surface treatment (e.g. O2 surface modification of patterned sapphire)
– Descum
| Gas cabinet |
| selection depend on gas cylinders |
| Additional Gas Channel, Toxic/Hazardous Gas Configuration |
| Allows the onboard gas enclosure to be populated with up to ten (10) channels in total. Frequently used to accommodate customer-specified process gases |
| Optical Emission Spectroscopy, EndpointWorks, Vision 320 RIE |
| Chamber Wall Heater, Vision 320 |
| Comprised of a heater jacket fitted to the outer surface of the process chamber |
| Additional Side Viewport, Vision 320 |
| Supplemental to the standard, front viewport. Provides extra viewing location to aid with system diagnostics. |
| Top Viewport, Vision 320 |
| Supplemental to the standard, front viewport. Provides extra viewing location to aid with system diagnostics. |
| Cortex | |
| •User friendly Digital communication using DeviceNet •Data logging and recipe management through open SQL Server environment •Integrated endpoint control •Alarm history, multiple user access levels, on-the-fly recipe control •Real-time process data display •Easy and safe override maintenance screens   |
Additional information
| Manufacturer | PlasmaTherm |
|---|---|
| Origin | USA |
| Type | Manual |