Automatic Dicing Saw DAD324
Φ6-inch Compact Dicing Saw which Achieves World’s Smallest Footprint while Improving Functionality
Max. workpiece size: Φ150 mm
Single spindle
- Description
- Additional information
Description
HIGHLIGHTS
Support for a variety of applications from semiconductor wafers to electronic parts
DAD324 is a single-axis dicing saw which is compatible with workpieces up to Φ6 inches with a 2.0 kW high-torque spindle. 150 x 150 mm workpieces can be processed using a user-specified specification
High productivity
Software operation speed and response speed are improved through adoption of a high performance MCU. The axis speed is accelerated and throughput is improved by adopting servo motors for all axes. In addition, this model uses PC electric components as standard and supports communication control as an option. The high-speed NCS (Non-Contact Setup) reduces measurement time.
World’s smallest footprint*
Compact design with a width of 490 mm
he reduced profile contributes towards a large increase in terms of productivity per unit area, especially when multiple.
Max. workpiece size | Φ6 inch / 150 mm × 150 mm (user-specified specification) | ||
X-axis | Cutting range | mm | 160 |
Cutting speed | mm/s | 0.1 ~ 800 | |
Y-axis | Cutting range | mm | 162 |
Index step | mm | 0.0001 | |
Index positioning accuracy | mm | 0.005/160 (Single error)0.003/5 | |
Z-axis | Max. stroke | mm | 32.2 (Φ2 inch blades) |
Moving resolution | mm | 0.000002(2nm) | |
Repeatability accuracy | mm | 0.001 | |
θ-axis | Max. rotating angle | deg | 320 |
Spindle | Output | kW | 2.0 at 40,000 min-1 |
Rated torque | N.m | 0.48 | |
Revolution speed range | min‐1 | 3,000 – 40,000 | |
Microscope section (alignment) | System | Pattern matching system based on the target patterns from the CCD camera | |
Scope | 0.64 mm square | ||
Magnification | ・7.5x (pixel size: 0.0013 mm) | ||
Direct light (LED) + Ring light (LED)[optional accessory] | Ring light provides workpieces with 360 degree illumination to deal with various workpiece surface conditions and kerf angle after cut | ||
Kerf check | ・Compensation on a hairline standard ・Kerf width max./min. ・Check setting of random locations ・Check setting for each cut line number | ||
Automatic light intensity adjustment | |||
Auto focus | |||
Auto alignment | |||
Device type change | Alignment conditions can be switched autodevice data are changed | ||
Alignment accuracy | ± 0.0013 mm | ||
Alignment capable die size | 0.4 mm or more |
XIS (Extended Interface System): Operation buttons are consolidated on the microscope screen. | |||
Wafer mapping: The processing status is displayed visually in the same way as fully automatic equipment. | |||
Log viewer: Analog data is displayed in a graph and equipment data is more easily visualized. | |||
Help viewer: Troubleshooting is displayed when an error occurs to achieve quick and accurate recovery support. |
Power supply | 200 ~ 240 V AC±10 %, 3-phase (50/60 Hz) |
Power consumption | When processing 0.6 kW (for reference) and During warm-up 0.5 kW (for reference) |
Max power | 3.5 kVA |
Air pressure | 0,5 ~ 0,6 MPa |
Air max consumption | 378,0 L / min (ANR) |
Clean air pressure | 0,5 ~ 0,8 MPa |
Clean air max. consumption | 162 L / min (ANR) |
Pressure water cutting | 0,2 ~ 0,4 MPa |
Max. flow rate Cutting water | 4 L / min |
Pressure cooling water | 0,2 ~ 0,4 Mpa |
Flow rate cooling water | 3.0 ở 0,3 MPa L / min |
Exhaust duct capacity | 5,0 m3 / min |
Machine dimensions(W x D x H) | 490 × 870 × 1,600 mm |
Machine weight | Approx.400 kg |
– semiconductor and electrical components manufacturer |
– used in dicing and performs the cutting of the silicon wafer |
USB flash drive | ||
Duct cuffs | 32 50 | |
Duct hoses | I.D. 32.0 2 m I.D. 50.6 2 m | |
Pipe band | 35-38 53-60 | |
Locating pin | For chuck table | |
Wheel cover | Centrifugal for 2.0kW spindle (resin type) | |
Flange specification selection | Hub specifications | Wheel mount set for hub |
R-type flange specifications | 48.2 × 40.0 | |
` | ||
50.6 × 40.0 | ||
52.0 × 40.0 | ||
54.0 × 40.0 | ||
Attached manual selection | Japanese manuals | Safety Manual Installation Manual Operation Manual Data Maintenance Manual Maintenance Manual Technical Reference |
English manuals | ||
Label selection: The languages used for the labels on the machine outer cover | Japanese English German French Italian Chinese (Simplified) Chinese (Traditional) Portuguese Korean | ・Rotating blade ・Moving parts ・Hot surface ・Hazardous voltage ・Line voltage always present |
1.8kW spindle specification | ||
Tape frame | ||
Cassette | ||
Starter kit for 2-inch hub mount | ||
Starter kit for R-type flange | ||
Spare 2-inch hub mount (for 2.0kW/1.8kW spindle) | ||
2-inch hub mount jig (spare) | ||
Chuck table | ||
Maintenance parts kit | ||
General | ||
Advanced | ||
Lifting jig set | ||
Axis metal fixture (spare) | ||
Machine anchoring bracket | ||
Braided hose | ||
Braided hose joint | ||
Pipe band | ||
Non-contact setup | ||
Abrasive material for non-contact setup sensor | ||
Blade breakage detector | ||
Wheel cover | ||
Power cables | ||
Transformer unit for use outside Japan (internal type) | ||
Uninterruptible power supply | ||
Booster pump unit | ||
Water leakage sensor | ||
Duct fan unit (internal type) | ||
Water temperature control unit | ||
Magnification of microscope (micro) | ||
Macro microscope | ||
Direct light specification | ||
Ring light specification | ||
Wheel coolant water (shower) flow switch | ||
Wheel coolant water (blade cooler) flow switch | ||
Flow rate controller for the wheel coolant water | ||
Spare USB flash drive | ||
Stylus pen | ||
Spare manuals | ||
Kerf center alignment | ||
Slow-in cutting function | ||
Measure alignment package | ||
CE-marking specification | ||
CC Filter unit | ||
High pressure air blower | ||
Linear scale (Y-axis) | ||
Duct capacity measuring instrument | ||
Anti-soiling porous chuck table |
Operation Control Screen | Indicates the directory name of the device data currently selected. |
Indicates the device data No. currently selected. | |
Indicates the software version installed in the machine. | |
Indicates the machine management No. for DISCO. | |
Indicates the machine ID specified on the USER DEFINE DATA 1 screen | |
Touch panel | A 15-type color LCD is employed to display alignment operation, cutting data, error messages, and other relevant information. It is also possible to operate the machine by directly touch the LCD. |
Operation screens | Easy operation is realized by adopting GUI (Graphical User Interface). |
Displayed guidance language | Can be selected from Japanese, English, Chinese (Simplified), or Chinese (Traditional). |
Additional information
Manufacturer | Disco |
---|---|
Origin | USA |
Type | Automatic |