Fully Automatic Dicing Saw – DFD6240
– By optimizing the frame structure and handling section layout, the footprint is on par with that of DISCO’s semi-automatic unit (DAD3350), even though it is equipped with all the functions of a fully automatic unit (size reduced by about 20% from the DFD641).
– The equipment is designed to reduce energy and air consumption, contributing to lower operation costs and environmental impact. In addition, the condition monitor relays the processing status and key equipment information in real time for use in periodic inspections and process management.
- Description
- Additional information
Description
HIGHLIGHTS
Enhanced dicing throughput
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.
Consistent cut quality
DFD6361 offers highly consistent and dependable cut quality through the new Synchro Spindle™ featuring superior radial rigidity. An atomizing nozzle cleaning mechanism can also be installed in the spinner unit as an option to effectively clean wafers after dicing (Patent no.3410385).
Spindle lineup
The 1.2 kW spindle (standard) features superior rigidity. A center thrust design gives the 1.8 kW spindle (option, uses 2 ” blades) and the 2.2 kW spindle (option, uses 3 ” blades) extra rigidity for processing glass, ceramics, and other high processing load materials
Improved usability
Auto-open/close wheel cover and spindle shaft-lock feature make blade replacement quick and easy. In addition, the condition monitor relays processing status and key equipment information in real time. DFD6361 also has a cutting water flow rate control feature, making it possible to manage the flow rate on the screen. An adjustable LCD touch screen with GUI (Graphical User Interface) have also been adopted
| Max. workpiece size | Φ8 inch |
| X-axis: – Cutting range – Cutting speed | 210 mm 0.1 ～ 600 mm/s |
| Y-axis – Cutting range – Index step – Positioning accuracy | – 210 mm – 0.0001 mm – Within 0.003/210 mm (Single error) Within 0.002/5 mm |
| Z-axis – Max. stroke – Moving resolution – Repeatability accuracy | – 19.22 (For Φ2 inch blade) for 1,2 + 1,8 kW, And 19.9 (Cho lưỡi cắt Φ3 inch) for 2.2kW – 0.00005 mm – 0.001 mm |
| θ-axis – Max. rotating angle | – 380 deg |
| Spindle – Rated torque – Revolution speed range | – 0.19 N.m ( 1.2kW), 0.29 N.m (1.8kW), 0.7 N.m (2.2kW) – 6,000 ～ 60,000 min‐1 (1,2 and 1.8 kW) and 3,000 ～ 30,000 min‐1 (2.2 kW) |
| Factory-friendly design: By optimizing the frame structure and handling section layout |
| Improved cut quality: – Offers highly consistent – The cutting water flow rate controller, programmable via the touch-panel display, sets the flow rate for each process recipe – Atomizing nozzle technology (option, patented in the USA, Japan, and other countries) |
| Improved usability: operation is simplified through adoption of the LCD touch panel and GUI (Graphical User Interface). |
| Higher throughput: Increased speed ranges and return speeds |
| Power supply | 200 ~ 240 V AC±10 %, 3-phase (50/60 Hz) |
| Power consumption | When processing 2.1 kW (for reference) and During warm-up 1.8 kW (for reference |
| Max power | 6,9 kVA |
| Air pressure | 0,5 ~ 0,8 MPa |
| Air max consumption | 378,0 L / min (ANR) |
| N2 Pressure | 0,5 ~ 0,8 MPa |
| N2 Max consumption | 216,0 L / min (ANR) |
| Pressure water cutting | 0,2 ~ 0,4 MPa |
| Max. flow rate Cutting water | 12 L / min |
| Water curtain | 1 pcs |
| Pressure cooling water | 0,2 ~ 0,4 Mpa |
| Flow rate cooling water | 3.0 ở 0,3 MPa L / min |
| Exhaust duct capacity | 5,0 m3 / min |
| Machine dimensions | 1.180 x 1.110 x 1.850 mm |
| Machine weight | Approx. 1,600 kg (without transformer for overseas use) |
| Approx. 1,670 kg (with transformer for overseas use) |
| – semiconductor and electrical components manufacturer |
| – used in dicing and performs the cutting of the silicon wafer |
Cassette and tape frame
High precision products to facilitate stable production from tape mounter to die bonder
Meets the ø300 mm wafer SEMI standard.
Automatic blade changer
Conducts blade change and resumes cutting fully automatically.
Minimizes the labour required and raises the utilization rate of the equipment.
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Additional information
| Manufacturer | Disco |
|---|---|
| Origin | USA |
| Type | Automatic |
