Automatic Dicing Saw DAD324

Φ6-inch Compact Dicing Saw which Achieves World’s Smallest Footprint while Improving Functionality
Max. workpiece size: Φ150 mm
Single spindle



Support for a variety of applications from semiconductor wafers to electronic parts
DAD324 is a single-axis dicing saw which is compatible with workpieces up to Φ6 inches with a 2.0 kW high-torque spindle. 150 x 150 mm workpieces can be processed using a user-specified specification

High productivity
Software operation speed and response speed are improved through adoption of a high performance MCU. The axis speed is accelerated and throughput is improved by adopting servo motors for all axes. In addition, this model uses PC electric components as standard and supports communication control as an option. The high-speed NCS (Non-Contact Setup) reduces measurement time.

World’s smallest footprint*
Compact design with a width of 490 mm
he reduced profile contributes towards a large increase in terms of productivity per unit area, especially when multiple.

Max. workpiece sizeΦ6 inch / 150 mm × 150 mm (user-specified specification)
X-axisCutting rangemm160
Cutting speedmm/s0.1 ~ 800
Y-axisCutting rangemm162
Index stepmm0.0001
Index positioning accuracymm0.005/160
(Single error)0.003/5
Z-axisMax. strokemm32.2 (Φ2 inch blades)
Moving resolutionmm0.000002(2nm)
Repeatability accuracymm0.001
θ-axisMax. rotating angledeg320
SpindleOutputkW2.0 at 40,000 min-1
Rated torqueN.m0.48
Revolution speed rangemin‐13,000 – 40,000
Microscope section (alignment)SystemPattern matching system based on the target patterns from the CCD camera
Scope0.64 mm square
Magnification・7.5x (pixel size: 0.0013 mm)
Direct light (LED) + Ring light (LED)[optional accessory]Ring light provides workpieces with 360 degree illumination to deal with various workpiece surface conditions and kerf angle after cut
Kerf check・Compensation on a hairline standard
・Kerf width max./min.
・Check setting of random locations
・Check setting for each cut line number
Automatic light intensity adjustment
Auto focus
Auto alignment
Device type changeAlignment conditions can be switched autodevice data are changed
Alignment accuracy± 0.0013 mm
Alignment capable
die size
0.4 mm or more

XIS (Extended Interface System): Operation buttons are consolidated on the microscope screen.
Wafer mapping: The processing status is displayed visually in the same way as fully automatic equipment.
Log viewer: Analog data is displayed in a graph and equipment data is more easily visualized.
Help viewer: Troubleshooting is displayed when an error occurs to achieve quick and accurate recovery support.
Power supply200 ~ 240 V AC±10 %, 3-phase (50/60 Hz)
Power consumptionWhen processing 0.6 kW  (for reference) and During warm-up 0.5 kW (for reference)
Max power3.5 kVA
Air pressure0,5 ~ 0,6 MPa
Air max consumption378,0 L / min (ANR)
Clean air pressure0,5 ~ 0,8 MPa
Clean air max. consumption162 L / min (ANR)
Pressure water cutting0,2 ~ 0,4 MPa
Max. flow rate Cutting water4 L / min
Pressure cooling water0,2 ~ 0,4 Mpa
Flow rate cooling water3.0 ở 0,3 MPa L / min
Exhaust duct capacity5,0 m3 / min
Machine dimensions(W x D x H)490 × 870 × 1,600 mm
Machine weightApprox.400 kg
– semiconductor and electrical components manufacturer
– used in dicing and performs the cutting of the silicon wafer
USB flash drive
Duct cuffs32
Duct hosesI.D. 32.0  2 m
I.D. 50.6  2 m
Pipe band35-38
Locating pinFor chuck table
Wheel coverCentrifugal for 2.0kW spindle (resin type)
Flange specification selectionHub specificationsWheel mount set for hub
R-type flange specifications48.2 × 40.0
50.6 × 40.0
52.0 × 40.0
54.0 × 40.0
Attached manual selectionJapanese manualsSafety Manual
Installation Manual
Operation Manual
Data Maintenance Manual
Maintenance Manual
Technical Reference
English manuals
Label selection: The
languages used for the labels on the machine
outer cover
Chinese (Simplified)
Chinese (Traditional)
・Rotating blade
・Moving parts
・Hot surface
・Hazardous voltage
・Line voltage always present

1.8kW spindle specification
Tape frame
Starter kit for 2-inch hub mount
Starter kit for R-type flange
Spare 2-inch hub mount (for 2.0kW/1.8kW spindle)
2-inch hub mount jig (spare)
Chuck table
Maintenance parts kit
Lifting jig set
Axis metal fixture (spare)
Machine anchoring bracket
Braided hose
Braided hose joint
Pipe band
Non-contact setup
Abrasive material for non-contact setup sensor
Blade breakage detector
Wheel cover
Power cables
Transformer unit for use outside Japan (internal type)
Uninterruptible power supply
Booster pump unit
Water leakage sensor
Duct fan unit (internal type)
Water temperature control unit
Magnification of microscope (micro)
Macro microscope
Direct light specification
Ring light specification
Wheel coolant water (shower) flow switch
Wheel coolant water (blade cooler) flow switch
Flow rate controller for the wheel coolant water
Spare USB flash drive
Stylus pen
Spare manuals
Kerf center alignment
Slow-in cutting function
Measure alignment package
CE-marking specification
CC Filter unit
High pressure air blower
Linear scale (Y-axis)
Duct capacity measuring instrument
Anti-soiling porous chuck table
Operation Control ScreenIndicates the directory name of the device data currently selected.
Indicates the device data No. currently selected.
Indicates the software version installed in the machine.
Indicates the machine management No. for DISCO.
Indicates the machine ID specified on the USER DEFINE DATA 1 screen
Touch panel A 15-type color LCD is employed to display alignment operation, cutting data, error messages, and other relevant information. It is also possible to operate the machine by directly touch the LCD.
Operation screens Easy operation is realized by adopting GUI (Graphical User Interface).
Displayed guidance
Can be selected from Japanese, English, Chinese (Simplified), or Chinese (Traditional).

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