3D Optical profilometer ContourX-200

The ContourX-200 Optical Profilometer provides the perfect blend of advanced characterization, customizable options, and ease of use for best-in-class fast, accurate, and repeatable non-contact 3D surface metrology. The gage-capable, small footprint system offers uncompromised 2D/3D high-resolution measurement capabilities using a larger FOV 5 MP digital camera and new motorized XY stage. Boasting unmatched Z-axis resolution and accuracy, the ContourX-200 provides all the industry recognized advantages of Bruker’s proprietary white light interferometry (WLI) technology without the limitations of conventional confocal microscopes and competing standard optical profilers.



Automation capabilities
Enable routines for faster measurement and analysis.

Motorized XY stage
Provides low-noise, high-speed operation for quantitative metrology.

Vibration-tolerant compact design
Delivers measurement stability and gage-capable repeatability.

– Max. Scan Range ≤10 mm
– Vertical Resolution<0.01 nm
– Step Height Accuracy<0.75%
– Step Height Repeatability<0.1% 1 sigma repeatability
– Max Scan37 μm/sec (with standard camera)
– Sample Height:≤100 mm (4 in.)
– XY Sample Stage150 mm (6 in.) automation stage
– Z FocusingAutomated
– ObjectivesParfocal: 2.5X, 5X, 10X, 20X, 50X, 115X; LWD: 1X, 1.5X, 2X, 5X,10X; TTM: 2X, 5X, 10X, 20X; Bright Field: 2.5X, w5X, 10X, 50X
– CameraMonochrome (standard) or color (optional); 5 MP with 1200×1000 data array
-AutomationAdvanced automated stitching,
scatter, and grid automation
standard auto focus; auto intensity; auto-saving; on-fly analysis; and recording into database
– CalibrationVia NIST/PTB traceable step height and lateral ruler standards
– System Footprint480 mm (W) x 604 mm (D) x
754 mm (H)
– Weight67 kg

Uncompromised, Best-in-Class Metrology
Built upon over four decades of proprietary WLI innovation, the ContourX-200 optical profilometer exhibits the low noise, high-speed, accuracy, and precision results that quantitative metrology requires. With the use of multiple objectives and integrated feature recognition, features can be tracked over a variety of fields of view and at sub-nanometer vertical resolution, providing scale-independent results for quality control and process monitoring applications in very diverse industries. ContourX-200 is robust in all surface situations from 0.05% to 100% reflectivity. New hardware features include an innovative stage design for larger stitching capabilities and a 5MP camera with a 1200×1000 measurement array for lower noise, larger field-of-view, and higher lateral resolution.

Widest Application Analysis Capabilities
Utilizing powerful VisionXpress and Vision64 user interfaces, the ContourX-200 offers thousands of customized analyses for productivity in labs and on the factory floors. Bruker’s new Universal Scanning Interferometry (USI) measurement mode provides fully automated, self-sensing surface texture, optimized signal processing while delivering the most accurate and realistic computation of the surface topography being analyzed. The larger FOV provided by the system’s new camera and flexibility afforded by the new motorized XY stage enables more flexibility and higher throughput for a broad range of samples and parts. The hardware and software combine to provide streamlined access to top optical performance, completely outclassing comparable metrology capabilities.


3D Optical profilometer are widely used as process motoring tools because they can quickly cover a large area, and are very versatile. They are best to be used for critical dimension, film thickness, and roughness measurements. They can also be used for defect detection and analysis.

Key application areas:
•Data Storage
•LED, Optics
•Precision Machining/Tribology

AcuityXR® combines unique, patent-pending Bruker hardware and software technology to enable select Contour 3D optical surface profilers to break the optical diffraction limit and deliver lateral resolutions previously considered unattainable with conventional optical microscopy techniques. It works on smooth surfaces where the phase of the reflected light is used to calculate surface height from the white-light-interferometric signal, improving sharpness, clarity, and definition of scratches, defects, and surface texture. Additionally, dimensional repeatability on nanoscale structures is improved by a factor of 5X.


Through Transmissive Media
“Enables high-resolution measurements through protective packaging, environmental chambers and other dispersive materials
– Measure samples through glass and other materials up to 3mm thick
– Innovative illumination enables up to 40x measurements
– Universal housing supports multiple magnifications and compensation materials
– 20x objective offers 25:1 aspect ratio for deep trench measurements
– For MEMS, materials science, biological applications, and more”


Above is a 3D dataset of the intact MEMS device using the 10x TTM module.

On the left, Image A shows the 3D image without TTM module. The right image, Image B, is the 10X image using Bruker’s TTM module showing high contrast and quality resolution.

The R&D 100 award winning TTM module is available with three objectives 2X, 10X, and 20X for magnifications from 1X to 40X. Simple manual exchange of glass slides makes the module flexible for materials of varied thicknesses.

Image A is the result of standard objectives imaging a 20um step height standard with 3mm cover glass on top. Image B is the result when using the TTM module to image through the same 3mm glass.


Upgrade Your Optical Profiler
Maximize your productivity with system hardware and software upgrades

– Hardware Upgrades
+ Computer Upgrade
The new Dell Precision computer with Windows 10 and the latest version of Vision64, version 5.70 enables new measurement capabilities, improved security, and enhanced remote support.

+ Automated FOV
The three position automated FOV allows quick swapping of FOV lenses from your computer.

+ Motorized XY Stage
The 6-inch automated XY stage enables stitching and stage automation.

+ High-Resolution Cameras
Bruker offers a selection of color and monochrome cameras to meet your application needs.

+ Automated 5-Position Turret
The automated five-position turret provides quick, efficient switching of objectives and adds objective parcentricity when used with a motorized XY stage. For use with all Bruker par-focal objectives.

+ Objectives and FOV Lenses
Increase capability of your optical profiler with Bruker objectives and FOV lenses. Bruker offers objectives with 1.5x to 115x magnifications.


– Software Upgrades
+ AcuityXR Enhanced Resolution Measurement Mode
The AcuityXR measurement mode enhances the lateral resolution when using PSI (Phase Shifting Interferometry) or VXI measurement modes with the benefit of maintaining an equivalent field of view at higher resolution. It combines unique, patent-pending, hardware and software technology to enable select 3D Optical Surface Profilers to break the optical diffraction limit and deliver lateral resolutions that are traditionally unattainable with conventional interferometry techniques.

– Optical Metrology Module: Optional automated or manual
turret; Optional motorized or manual discrete modules.

– Camera: color

Vision64 and VisionXpress Analysis Software on Windows 10 OS; 64-bit
ContourX-200 comes complete with Vision64®, the industry’s most advanced operation and analysis software. New VisionXpress™ provides an even easier to use interface and streamlined capabilities with access to an extensive library of pre-programmed filters and analyses for precision machined surfaces, thick films, semiconductor, ophthalmic, medical device, MEMS and tribology applications.

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