Fully Automatic Dicing Saw – DFD6340
Fully Automatic Dicing Saw – DFD6340 with Φ200 mm ,Facing dual spindle, DBG (Dicing Before Grinding), Package Singulation.
Shorter set up time – two NCS* sensors
Two Non-Contact Setup sensors, one each for Z1 & Z2, enables increased throughput.
Process stability – cutting water flow control
Cutting water flow rate can be set in the device data. In addition, water flow rate is monitored during processing, making it possible to ensure a constant and stable flow rate.
Shorter kerf check time – two microscopes*
A dedicated high-magnification microscope for each spindle allows for simultaneous kerf checking for increased throughput
Easy operation
The DFD6340 utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy. The inclusion of an inspection stage allows for the removal and checking of wafers after dicing during fully automatic operation.
DFD6340 Operation flow
1/ Lower arm moves the workpiece from the cassette to the pre-alignment stage. Lower arm moves the workpiece to the chuck table → cutting →2/ Upper arm moves the workpiece to the spinner table → cleaning & drying →3/ Lower arm returns the workpiece to the cassette
- Description
- Additional information
Description
HIGHLIGHTS
Consistent cut quality
The DFD6340 offers consistent cut quality with the adoption of a Synchro Spindle™ featuring superior radial rigidity. An atomizing nozzle cleaning mechanism can also be included in the spinner unit as an option to effectively clean wafers after dicing (Patent no. 3410385).
Maximized throughput
The DFD6340 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30 % for step/bevel cut and 40 % for dual cut when compared with parallel dual spindle dicing saws.
Lower air and energy consumption
Utilizing the latest in conservation technology, the energy and air consumption of the DFD6340 has been reduced by 33 % and 24 % respectively when compared to the previous generation of saws
Small footprint
By employing a new high-rigidity, bridge-type frame structure, the DFD6340 has the smallest footprint of any 8″ saw in its class.
| Max. workpiece size | Φ8 inch |
| X-axis: – Cutting range – Cutting speed | 210 mm 0.1 ～ 600 mm/s |
| Y1 – Y2 axis – Cutting range – Index step – Positioning accuracy | – 210 mm – 0.0001 mm – Within 0.002/210 mm (Single error) Within 0.002/5 mm |
| Z-axis – Max. stroke – Moving resolution – Repeatability accuracy | – 19.22 (For Φ2 inch blade) for 1,2 + 1,8 kW, And 19.9 (Cho lưỡi cắt Φ3 inch) for 2.2kW – 0.00005 mm – 0.001 mm |
| θ-axis – Max. rotating angle | – 380 deg |
| Spindle – Rated torque – Revolution speed range | – 0.19 N.m ( 1.2kW), 0.29 N.m (1.8kW), 0.7 N.m (2.2kW) – 6,000 ～ 60,000 min‐1 (1,2 and 1.8 kW) and 3,000 ～ 30,000 min‐1 (2.2 kW) |
| Machine dimensions | 1.180 x 1.110 x 1.850 mm |
| Machine weight | Approx. 1,600 kg (without transformer for overseas use) |
| Approx. 1,670 kg (with transformer for overseas use) |
| Facing dual spindle |
| Utilizing the latest in conservation technology |
| The DFD6340 offers consistent cut quality with the adoption of a Synchro Spindle™ featuring superior radial rigidity |
| Cutting water flow rate can be set in the device data |
| The DFD6340 has the smallest footprint of any 8″ saw in its class. |
| Power supply | 200 ~ 240 V AC±10 %, 3-phase (50/60 Hz) |
| Power consumption | When processing 2.1 kW (for reference) and During warm-up 1.8 kW (for reference |
| Max power | 6,9 kVA |
| Air pressure | 0,5 ~ 0,8 MPa |
| Air max consumption | 378,0 L / min (ANR) |
| N2 Pressure | 0,5 ~ 0,8 MPa |
| N2 Max consumption | 216,0 L / min (ANR) |
| Pressure water cutting | 0,2 ~ 0,4 MPa |
| Max. flow rate Cutting water | 12 L / min |
| Water curtain | 1 pcs |
| Pressure cooling water | 0,2 ~ 0,4 Mpa |
| Flow rate cooling water | 3.0 ở 0,3 MPa L / min |
| Exhaust duct capacity | 5,0 m3 / min |
| – semiconductor and electrical components manufacturer |
| – used in dicing and performs the cutting of the silicon wafer |
Update….
| Cassette and tape frame | High precision products to facilitate stable production from tape mounter to die bonder |
| Meets the ø300 mm wafer SEMI standard. | |
| Automatic blade changer | Conducts blade change and resumes cutting fully automatically. |
| Minimizes the labour required and raises the utilization rate of the equipment. | |
| Shorter set up time – two NCS* sensors | Two Non-Contact Setup sensors, one each for Z1 & Z2, enables increased throughput. |
| Shorter kerf check time – two microscopes* | A dedicated high-magnification microscope for each spindle allows for simultaneous kerf checking for increased throughput |
Updating….
Additional information
| Manufacturer | Disco |
|---|---|
| Origin | USA |
| Type | Automatic |
