YXLON Cougar EVO The customized standard with the smallest footprint for x-ray inspection in SMT, Semicon and laboratories

Future smart factories are all about connectivity and self-optimizing processes. Therefore, the most valuable quality control systems are the ones that offer improved automated inspections and can become an integral part of the production line. The new Cheetah EVO system is smartly designed to meet the demands of Industry 4.0, guaranteeing efficient and reliable zero fault production. It is equipped with dosage mode for especially sensitive components, has high-load capacity and a larger detector size for utmost flexibility. With the new FF CT Software, it enables optimized automated X-ray and CT industrial quality inspections, delivering even more accurate results. It is the outcome of Yxlon’s constant need for innovation and it is here to empower you today and in the future.



One-click solutions make it easy to perform the advanced manipulations required for fast and reliable X-ray inspection. Such as:
– Click & Center
– Frame & Zoom
– PowerDrive
– Zoom+
These functions guarantee constant-intensity magnification without tube adjustments or software interpolation, and can be carried out with one simple click.

To ensure highest product quality, the eHDR filter highlights complex structures with just one click. Thanks to our advanced software and enhanced 16-bit gray scale values, it detects even the slightest variances in gray scale, so that no defect will be missed. This allows you to easily see faults that were invisible before.

Today’s soldering connections are getting more and more complex. QFNs and other bottom-terminated devices can only be inspected using x-ray. Faulty or missing solder joints and large areas of voiding are reliably detected, and MAVC helps analyze voids in complex soldering designs. With just four parameters to adjust, setup is quick, simple, and cost-efficient. Results are consistent, repeatable, and accurate.

General Product Features
Time to first image (typ.)~ 10 s
Reconfiguration time (typ.)< 60 s
Acquisition time (Quick Scan)
for 2000 projections
~ 3.15 min
Reconstruction time (Quick Scan)
for 2000 projections
~ 1.55 min
Acquisition time (micro3Dslice Semicon) for 120 projections~ 1.45 min
Reconstruction time (micro3Dslice Semicon) for 120 projections~ 0.30 min
Access for sample loadinglarge automated door (690 x 650 mm)
Cabinet window520 x 370 mm
Monitor27” Ultrasharp, wide viewing angles
Image stabilizationair suspension
3D modes– Laminography (micro3Dslice)
– CT Quick Scan
– Quality Scan
Manipulation controlvia mouse or joystick
Manipulation axesX,Y,Z(D)
Oblique viewing+/-70° (140°)
X-ray inspection system
Max. dose rate ( at 100 mm distance to the cabinet surface)< 1μSv/h
Inspection parts
Max. part size440 mm x 550 mm (17” x 21”)
Max. radiographic area310 mm x 310 mm (12” x 12”)
Max. part weight (standard)5 kg
Max. part weight rotation2 kg

X-ray sourceXT-160.50 Microfocus FXT-160.51 Multifocus 
Voltage range20 – 160 kV20 – 160 kV
Current range0.001 – 1.0 mA0.001 – 1.0 mA
Tube powermax. 64 Wmax. 64 W
Target powermax. 15 Wmax. 15 W
Target materialTungstenTungsten
Detail detectability0.75 μm< 0.3 μm
 X-ray intensity controlTXITXI
Image Chain
Geometric magnification~ 3,000 x~ 3,000 x
Total magnification~ 384,000 x~ 384,000 x
Spatial Resolution1.5 μm0.6 μm

DetectorY.Panel 1308 Y.Panel 1313 
Max. resolution (Pixel)1004 x 6201004 x 1004
Pixel size127 μm2127 μm2
Pixel area128 mm x 79 mm128 mm x 128 mm
A/D transformer16 bit16 bit

Dimensions (w x d x h)1,000 x 1,050 x 2,200 mm
Weight 1,450 kg




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