YXLON Cougar EVO The customized standard with the smallest footprint for x-ray inspection in SMT, Semicon and laboratories
Future smart factories are all about connectivity and self-optimizing processes. Therefore, the most valuable quality control systems are the ones that offer improved automated inspections and can become an integral part of the production line. The new Cheetah EVO system is smartly designed to meet the demands of Industry 4.0, guaranteeing efficient and reliable zero fault production. It is equipped with dosage mode for especially sensitive components, has high-load capacity and a larger detector size for utmost flexibility. With the new FF CT Software, it enables optimized automated X-ray and CT industrial quality inspections, delivering even more accurate results. It is the outcome of Yxlon’s constant need for innovation and it is here to empower you today and in the future.
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HIGHLIGHTS
ONE CLICK PHILOSOPHY
One-click solutions make it easy to perform the advanced manipulations required for fast and reliable X-ray inspection. Such as:
– Click & Center
– Frame & Zoom
– PowerDrive
– Zoom+
These functions guarantee constant-intensity magnification without tube adjustments or software interpolation, and can be carried out with one simple click.
eHDR-INSPECT
To ensure highest product quality, the eHDR filter highlights complex structures with just one click. Thanks to our advanced software and enhanced 16-bit gray scale values, it detects even the slightest variances in gray scale, so that no defect will be missed. This allows you to easily see faults that were invisible before.
MULTI AREA VOID CALCULATION (MAVC)
Today’s soldering connections are getting more and more complex. QFNs and other bottom-terminated devices can only be inspected using x-ray. Faulty or missing solder joints and large areas of voiding are reliably detected, and MAVC helps analyze voids in complex soldering designs. With just four parameters to adjust, setup is quick, simple, and cost-efficient. Results are consistent, repeatable, and accurate.
General Product Features | |
Time to first image (typ.) | ~ 10 s |
Reconfiguration time (typ.) | < 60 s |
Acquisition time (Quick Scan) for 2000 projections | ~ 3.15 min |
Reconstruction time (Quick Scan) for 2000 projections | ~ 1.55 min |
Acquisition time (micro3Dslice Semicon) for 120 projections | ~ 1.45 min |
Reconstruction time (micro3Dslice Semicon) for 120 projections | ~ 0.30 min |
Access for sample loading | large automated door (690 x 650 mm) |
Cabinet window | 520 x 370 mm |
Monitor | 27” Ultrasharp, wide viewing angles |
Zoom+ | yes |
PowerDrive | yes |
Image stabilization | air suspension |
3D modes | – Laminography (micro3Dslice) – CT Quick Scan – Quality Scan |
Manipulation | |
Manipulation control | via mouse or joystick |
Manipulation axes | X,Y,Z(D) |
Oblique viewing | +/-70° (140°) |
X-ray inspection system | |
Max. dose rate ( at 100 mm distance to the cabinet surface) | < 1μSv/h |
Inspection parts | |
Max. part size | 440 mm x 550 mm (17” x 21”) |
Max. radiographic area | 310 mm x 310 mm (12” x 12”) |
Max. part weight (standard) | 5 kg |
Max. part weight rotation | 2 kg |
X-ray source | XT-160.50 Microfocus | FXT-160.51 Multifocus |
Target | transmission | transmission |
Voltage range | 20 – 160 kV | 20 – 160 kV |
Current range | 0.001 – 1.0 mA | 0.001 – 1.0 mA |
Tube power | max. 64 W | max. 64 W |
Target power | max. 15 W | max. 15 W |
Target material | Tungsten | Tungsten |
Detail detectability | 0.75 μm | < 0.3 μm |
X-ray intensity control | TXI | TXI |
Image Chain | ||
Geometric magnification | ~ 3,000 x | ~ 3,000 x |
Total magnification | ~ 384,000 x | ~ 384,000 x |
Spatial Resolution | 1.5 μm | 0.6 μm |
Detector | Y.Panel 1308 | Y.Panel 1313 |
Max. resolution (Pixel) | 1004 x 620 | 1004 x 1004 |
Pixel size | 127 μm2 | 127 μm2 |
Pixel area | 128 mm x 79 mm | 128 mm x 128 mm |
A/D transformer | 16 bit | 16 bit |
Dimensions (w x d x h) | 1,000 x 1,050 x 2,200 mm |
Weight | 1,450 kg |
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Thông tin bổ sung
Hãng sản xuất | YXLON |
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Xuất xứ | Đức |
Loại | Bán tự động |